History

"Our company has a stable position in the market. We have been building its tradition since 1960"

MILESTONES OF OUR SUCCESS:

date	event
1960	Establishing Student Work Co-operative "Techno-Service".
1982	STARTING THE ENVIRONMENT PROTECTION LABORATORY.
1984	SETTING UP THE PRINTED CIRCUIT PRODUCTION PLANT - the first board leaves the production line. The new technology was developed at the Tele and Radio Engineering Institute in Warsaw.
1990/1991	Establishing "TECHNO-SERVICE" joint stock company
1993	Start of a dynamic development of the Printed Circuit Production Plant - modernization investments, purchase of capital assets and equipment. Development of modernization program for the Environment Protection Laboratory
1994	Start of rebuilding and modernization of the premises at Benzynowa street in Gdańsk as the target location for the Printed Circuit Production Plant. SETTING UP THE ELECTRONICS ASSEMBLY PLANT.
1996	Start of exporting printed circuits to European markets.
1997	Construction of Customer Service Office at the Printed Circuit Production Plant. Decision to change the technology of manufacturing printed circuits – adapting to European standards. Developing a two-year modernization program needing DM 2 500 000 worth of outlay.
1998	Activating direct bonding Process performer at the brand new BLACK HOLE LINE which is the only one in Poland - the beginning of co-operation with Mac Dermid company. Implementation of silk screen printing based on CIBA technological line.
2001	Dynamic development of the Electronics Assembly Plant - beginning of electronic assembly in SMT technology.
2002	Implementing the Quality Management System and gaining ISO 9001: 2000 certificate. The Printed Circuit Production Plant attains the status of the biggest and most modern manufacture plant in the business in Poland. Modernization of the Electronics Assembly Plant - the purchase of a complete SMT assembly line.
2004	Implementing the Integrated System of Quality and Environmental Management compatible with the requirements of the ISO 9001:2000 and ISO 14001:1996 standards.
2005	Another phase of investment at the Electronics Assembly Plant Editing Works, which enables us to achieve the production level of 5,5 million SMD components a month. Work connected with adapting the Plant to the unleaded soldering process.
2006	Practical implementation of the unleaded soldering technology into production at the Electronics Assembly Plant. Implementing unleaded coatings in the Printed Circuit Production Plant basing on : - gold plating (ENIG) - unleaded HAL. Building of the Ecological Electronics Assembly Center TSTRONIC.